|
| Bump-Bonder WBB-700 |
This bonding machine was specially developed for bumping applications.
| · bumping speed: | 0.035 sec./wire (28 bumps/sec.) |
| · bonding area: | 54 mm x 66 mm (X/Y) |
| · wire diameter: | 15 µm to 30 µm |
| · XY-range | 250 mm x 250 mm for 8" wafer other mesurements possible |
wire diameter 15 µm (pull-cut mode)
bump diameter: 29 µm
bump thickness: 9.5 µm
bump height: 40 µm
wire diameter 30 µm (leveling mode)
Bump Diameter: 100 µm
Bump Thickness: 22 µm
Bump Height: 42 µm
on stich bond
